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Ceramic Split Sleeve
Ceramic Split Sleeve
Ceramic Split Sleeve
Ceramic Split Sleeve
Ceramic Split Sleeve
Ceramic Split Sleeve

Ceramic Split Sleeve

including semiconductor wafer and waferprocessing, semiconductor manufacturing and semiconductor packaging
• Ultra-high dimensional accuracy
• High physical strength
• Excellent wear resistance
• Good anti-aging performance
•Strong signal penetrability, various colors, and smooth hand feel

characteristic

unit

Alumina Ceramics

Zirconia Ceramics

99.7%Aluminum oxide

99%Aluminum oxide

96%Aluminum oxide

white zirconia ZrO2-3Y

black zirconia ZrO2-3Y

density

g/cm3

≧3.92

≧3.88

≧3.65

≧6.0

≧6.0

color

/

ivory

ivory

White

ivory

black

Bending strength

MPa

≧600

≧600

≧300

≧1000

≧800

Vickers hardness

HV

2000

1800

1400

1200

1200

Elastic Modulus

GPa

200

200

200

/

/

Thermal Conductivity

W/m.k

30

30

18

/

/

 

 

 

 

 

 

 

characteristic

unit

Zirconia Toughened Alumina Ceramics

 

10% Zirconia Toughened Alumina

20% Zirconia Toughened Alumina

Zirconia Toughened Ruby

40% Zirconia Toughened Alumina

 

density

g/cm3

≧4.0

≧4.25

≧4.25

≧4.8

 

color

 

White

White

pink

White

 

Bending strength

MPa

≧700

≧800

≧800

≧800

 

Vickers hardness

HV

2000

1800

1800

1500

 

Elastic Modulus

GPa

/

/

/

/

 

Thermal Conductivity

W/m.k

/

/

/

/